CuproShield Cu-18(S)

Introduction

CuproShield Cu-18(S) is a specialized protective agent for copper and copper alloys. It belongs to a water-soluble process and is a nanotechnology product. This protective agent forms a colorless transparent film on the surface of copper and copper alloys, with a thickness of several nanometers. It can prevent corrosion of workpieces by water, seawater, atmosphere, oxygen, hydrogen sulfide, sulfur dioxide, and some organic vapors. It is mainly used for the protection of copper and copper alloys in indoor environments. Using our company's water cutting agent simultaneously can achieve even better protection.

Process Characteristics

1. The process operation is simple. Simply immerse the thoroughly cleaned workpiece in the working fluid to form an effective film on the surface of the workpiece. 

2. This is a water soluble process; it is safe and environmentally friendly. 

3. This film does not affect the soldering performance of the copper layer and virtually does not change the contact resistance, making it suitable for protecting electronic components and copper layers on circuit boards. 

4. This protective layer has no protective effect against the erosion of ammonia or cyanide. 

5. The surface has hydrophobicity and poor adhesion with general organic coatings and binders.

Composition of Plating Solution and Process Flow

The operation of CuproShield Cu-18(S) is simple; just dilute the concentrated solution in pure water to use. The process is as follows: 

1. Copper plating 

2. Water washing (two times) 

3. 10% sulfuric acid washing 

4. Water washing (two times) 

5. Immersion in protective agent (pay attention to temperature and time; too short of time adversely affects the protective effect; too long of time is not an issue) 

6. Water washing (three times) 

7. Hot washing 

8. Spin drying 

9. Drying 

10. Baking at 120℃ (20 - 40 minutes) 

11. Inspection and storage 

Note that the time between copper plating and immersion in the protective agent should be as short as possible to prevent the copper layer from oxidizing prior to protection. If this process is difficult to achieve, the oxide film can be removed by immersion in dilute acetic acid before immersion in the protective agent.

Operating Conditions

Equipment

1. Use stainless steel grooves, glass grooves, grooves lined with rubber, or polypropylene. 

2. Use quartz, porcelain, stainless steel heating tubes, or water bath heating. 

3. Workpieces can be loaded using baskets, rollers, or hanging tools.

Preparation and Operation of Tank Solution

1. Thoroughly clean the work tank. 

2. Add 70% volume of pure water to the tank and adjust the temperature to the operating temperature. 

3. Melt CuproShield Cu-18(S) in a hot water bath before use. 

4. Stir and add the required amount CuproShield Cu-18(S) 

5. Add pure water to the working liquid level and continue to stir evenly. 

6. Adjust the working temperature of the solution. 

7. Immerse the workpiece (that has been thoroughly cleaned and kept moist) into the working fluid for processing. 

8. Clean the processed workpiece with running water; then dry it in stable hot air. The hot air temperature should not exceed 80℃. 

9. Workpieces treated with water cutting agents can be subjected to 120℃ baking aging treatment for better results.

Solution Maintenance

1. Prevent copper, oil stains, wax, alkaline, and acidic washing liquids from contaminating the working fluid; otherwise, it will weaken the protective treatment effect of the solution. 

2. During use, CuproShield Cu-18(S) will undergo decomposition and be lost. CuproShield Cu-18(S) concentrate should be added through analysis to compensate for this loss. 

Note: If workpieces treated with CuproShield Cu-18(S) need to be re-electroplated, the protective film must be removed in a hot alkaline anode degreasing solution before electroplating can be applied.