Introduction
SterlingShield Anti-EBO-5620 is specifically designed to address the packaging delamination of semiconductor lead frames. SterlingShield Anti-EBO-5620 effectively solves the delamination problem caused by the oxidation of copper, silver, gold, and nickel surfaces on the lead frame in subsequent packaging. After SterlingShield Anti-EBO-5620 treatment, the high temperature resistance of copper is greatly improved, thereby enhancing the adhesion between the EMC and the copper surface.
In order to improve the bonding strength between EMC with copper, silver, gold, and nickel surfaces, a copper surface micro etching treatment is added before the silver plating process. After the micro etching treatment, the specific surface area of the copper surface increases. Note that micro etching treatment is optional and depends on slot availability on the production line.
SterlingShield Anti-EBO-5620 uses a water-soluble process and is composed of two products: SterlingShield Anti-EBO-5620 A and Anti-EBO-5620 B Booster.
The main function of SterlingShield Anti-EBO-5620 A is to improve the adhesion between EMC with copper, silver, gold, and nickel surfaces. If the anti silver adhesive diffusion on the surface of the lead frame cannot meet the requirements after SterlingShield Anti-EBO-5620 A treatment, SterlingShield Anti-EBO-5620 B Booster can be used to further improve the anti silver adhesive diffusion ability of the copper, silver, gold, and nickel surfaces.
Operating Process
Componente | Temperature | Process | Time |
SterlingShield Anti-EBO-5620 A | 30oC | Slotting: 1.2 - 1.8%
Daily replenishment: 0.15-0.2% V/V of tank solution
Re-slot within 3 - 7 days | 10 - 20 Seconds |
DI Water | Clean with pure water three times | ||
SterlingShield Anti-EBO-5620 B Booster | 30oC | Slotting: 1.2 - 1.8%
Daily replenishment: 0.15-0.2% V/V of tank solution
Re-slot within 3-7 days | 10 - 20 Seconds |
DI Water | Clean with pure water three times | ||
Drying Temperature | 90oC |
Operating Method
Before immersing the workpiece in SterlingShield Anti-EBO-5620, it must be cleaned, moistened, and free of oil stains. Since SterlingShield Anti-EBO-5620 does not have a cleaning function, a protective film will not form on surfaces with stains.
Concentration Analysis
Materials required:
1. Anti silver adhesive diffusion agent stock solution SterlingShield Anti-EBO-5620
2. Refractometer (AK002A is recommended)
Methodology:
1. Prepare standard solution.
2. Prepare 1%, 2%, 4%, 6%, 8%, and 10% concentration solutions with the SterlingShield Anti-EBO-5620 original solution.
3. Use pure water as the reference; test the refractive index and draw the curve.
4. Test the refractive index of the protective agent tank, and calculate the concentration of SterlingShield Anti-EBO-5620 in the protective agent tank solution.
Disclaimer
All proposals or suggestions regarding our company's products in this manual are based on experiments and data that our company trusts. Due to the inability to control the actual operations of other practitioners, our company cannot guarantee or be responsible for any adverse consequences.